Molybdenum dis kto its excellent physical and chemical properties have been widely applied

Molybdenum due to its excellent physical and chemical properties are widely used, is the core of molybdenum alloy substrate supporting parts thyristor semiconductor modules , which plays to protect the chip to work, to extend the fatigue life of the thyristor and so on. But there are some applications of molybdenum problems , such as difficulty plating itself , molybdenum itself easily oxidized in air at 400 ℃, the surface oxide film is easily generated . However, molybdenum oxide  molybdenum wire  not play any protective effect, so molybdenum best for semiconductor devices coated with a protective film . This paper studies the field of molybdenum plating areas , focusing on the pre-treatment process of molybdenum , molybdenum , ruthenium plating and electroplating  molybdenum electrode  coating adhesion and uniformity improvements were studied . In this paper, pre-treatment process for molybdenum were studied . Pre-treatment process for molybdenum molybdenum subsequent coating quality has a crucial impact on the existing pre-treatment process , if applied to industrial production have many problems , so this paper by testing and analysis , development of a kinds of new pre-treatment process , not only to achieve the removal of oil , peel oxide and other results, while enhancing the substrate and subsequent coating machinery bite force for subsequent plating ruthenium laid a solid foundation , but also to achieve a safe, efficient target.