Cylindrical planar magnetron sputtering target characteristics and design principles

Magnetron sputtering film TROUBLESHOOTING
    Gray and black films
(A) vacuum of less than 0.67Pa. Vacuum should be increased to 0.13-0.4Pa.
  (2) purity of less than 99.9% of argon. Should be replaced with a purity of 99.99% argon.
  (3) inflation system leak. Pneumatic systems should be checked to exclude air leaks.
  (4) the primer is not sufficiently cured. Should be appropriate to extend the primer cure time.
  (5) plating outgas too. Should be dried and sealing treatment
Film surface luster dim
(1) primer curing bad or deterioration. Should be appropriate to extend the primer cure time or replace primer.
  (2) the sputtering time is too long. Should be appropriately reduced.
  (3) a sputtering deposition rate is too fast. Should be appropriately reduced sputtering current or voltage

Uneven color film
(1) Primer coating unevenly. Primer application Molybdenum target should be improved.
  (2) thin film. Should increase the sputtering rate or extend the sputtering time.
  (3) fixture design is unreasonable. Fixture design should be improved.
  (4) the geometry of the plating is too complicated. Should increase the rotational speed of plating
Film wrinkling, cracking
(1) primer coating too thick. Should be controlled in the range of 7-lOtan thickness.
  (2) high viscosity coatings. Should be appropriately reduced.
  (3) evaporate too fast. Should be appropriate to slow down.
  (4) The film is too thick. Should be appropriate to shorten the sputtering time.
  (5) plating temperature is too high. Should be appropriate to shorten the heating time for plating
Film surface water stains, fingerprints and dust particles
(A) plating is not fully dry after cleaning. Should strengthen pre-plated.
  (2) plated surface splashed with water droplets or saliva. Should strengthen civilized production, the operator should wear masks.
  (3) primer FLAC contact plating, surface leaving fingerprints. Should not touch plated surface.
  (4) coating with particles. Paint coatings should be filtered or replaced.
  (5) Failure or spraying electrostatic precipitator and curing environment with dust particles. Should replace the filter, and maintain a working environment clean
Poor adhesion layer
(A) plating degreasing is not complete. Should strengthen pre-plated.
  (2) Vacuum chamber cleaning. Vacuum chamber should be cleaned. It should be noted that, in the loading target and dismantle the target process, prohibited by hand
Or clean contact with a source object and the magnetron to ensure magnetron source has a higher cleanliness, it is important to improve the binding force film
To one of the measures.
  (3) fixture dirty. Fixture should be cleaned.
  (4) improper selection primer. Should be replaced coatings.
  (5) improper control of the sputtering process conditions. Sputtering process conditions should be improved
Cylindrical planar magnetron sputtering target characteristics and design principles
Abstract: This paper introduces a rectangular planar target based on the structural principles of design cylindrical, planar magnetron sputtering target approach. And how to play cylindrical, planar magnetron sputtering target the advantages are analyzed.
Keywords: magnetron sputtering; target; vacuum coating