high thermal conductivity

Copper Molybdenum Copper (CMC) packaging material is a flat composite sandwich structure, which uses pure molybdenum as the core material, and then covered with double-sided dispersion strengthened copper or copper.
The thermal expansion coefficient of this material is adjustable, high thermal conductivity, high temperature performance, in electronic packaging has been widely used. Copper molybdenum plating Copper materials are metal matrix composite planar layered electronic packaging materials, such composite materials for electronic packaging structure is stacked, generally divided into three layers, the middle layer of low expansion material layer, both sides of the high thermal conductivity of the material layer Of course, there are two, or four composite laminates. Production generally use rolling compound, composite plating, explosion forming, prepared by processing methods, such materials have very good in a planar direction and a low thermal conductivity coefficient of expansion, and there is substantially no problem dense, in addition, it kinds of materials processing cost is relatively low, for example, rolls of continuous rolling composite production Cu / Invar / Cu composite plates, can greatly reduce production costs, can be processed into 70um foil, can be widely used in PCB's core and lead frame material. Because the CMC theory of high thermal conductivity, coefficient of expansion match to Si, as early as the 1990s, domestic and foreign experts and scholars on its in-depth study of American companies and Climax Specialty Metals AMAX companies use hot composite method produced by Cu / Mo / Cu (CMC) composite materials, and applied for a patent, has been used in B2 stealth bomber electronic devices. CMC CIC are the same as the structure and three-layer composite structure, but the hardness, tensile strength, heat conductivity and high electrical conductivity than the CIC, and this is because the middle of CMC molybdenum plate, molybdenum and strength, electrical conductivity, and thermal conductivity are higher than Inar alloys.
U.S. Polymetallurgical, Polese, Elcon other companies using online technology to produce continuous rolling complex variety of sizes, partial or full wrap of electronic packaging materials, and Mo / Cu, W / Cu particles produced by powder metallurgy and other enhanced electronic packaging materials, composite method to produce flat-rolled composite electronic packaging materials