Magnetron sputtering technique

Molybdenum tube sputtering technique developed in the 1970s a new sputtering technique, has been in the practical application of scientific research and production. Magnetron sputtering is mainly used for the electronics industry, magnetic materials and recording media, optical and optical communications, high-speed, low-temperature, low damage and so on. Speed ​​is fast deposition rate; low temperature and low damage the substrate temperature is low, the less damage.2 Principles and magnetron sputtering magnetron sputtering target2.1 Principles magnetron sputtering
Magnetron sputtering is the principle of magnetron sputtering target in a vacuum chamber, the anode (vacuum chamber) and a cathode target (material to be deposited) DC voltage between the plus enough, a certain strength of the electrostatic field E. In a vacuum chamber and then filled with argon, in the action of the electrostatic field E, and to produce high ionized argon argon ion A + r and the secondary electron e1. The A + r in high electric field E is accelerated toward the sputtering target and the target surface with high energy bombardment, the sputtering surface of the target. The sputtering particles, neutral target atoms (or molecules) is deposited on the substrate forming a thin film (Figure 1) [1].
The role of the magnetic field B, on the one hand around the cathode target, forming a high density plasma glow in the region, a large amount of ionized A + r to bombard the target surface, a large number of sputtered particles to the surface of the metal deposited ; other hand, secondary electrons accelerated toward the target surface e1, while a magnetic field B, the Lorentz force to the composite trochoid and spiral form on the target surface in a circular motion. With the increase in the number of collisions, the energy of electron e1 gradually reduced, little energy to pass the substrate, the substrate temperature is low. When the sputtering reaches a certain level, the surface of the target material will be consumed to form a concave widened annular area etching [1].
2.2 magnetron sputtering target in the process of coating the important role
Magnetron sputtering vacuum magnetron sputtering target is a core component of its important role mainly in the following two aspects (1) for coating large surfaces, magnetron sputtering target affects the uniformity of the film and Repeatability; (2) when the film material is a precious metal, the target structure determines the target (forming thin films), that is, the precious metal utilization.
Magnetron sputtering technique developed in the 1970s a new sputtering technique, has been in the practical application of scientific research and production. Magnetron sputtering is mainly used for the electronics industry, magnetic materials and recording media, optical and optical communications, high-speed, low-temperature, low damage and so on. Speed ​​is fast deposition rate; low temperature and low damage the substrate temperature is low, the less damage.2 Principles and magnetron sputtering magnetron sputtering target2.1 Principles magnetron sputtering
Magnetron sputtering is the principle of magnetron sputtering target in a vacuum chamber, the anode (vacuum chamber) and a cathode target (material to be deposited) DC voltage between the plus enough, a certain strength of the electrostatic field E. In a vacuum chamber and then filled with argon, in the action of the electrostatic field E, and to produce high ionized argon argon ion A + r and the secondary electron e1. The A + r in high electric field E is accelerated toward the sputtering target and the target surface with high energy bombardment, the sputtering surface of the target. The sputtering particles, neutral target atoms (or molecules) is deposited on the substrate forming a thin film (Figure 1) [1].
The role of the magnetic field B, on the one hand around the cathode target, forming a high density plasma glow in the region, a large amount of ionized A + r to bombard the target surface, a large number of sputtered particles to the surface of the metal deposited ; other hand, secondary electrons accelerated toward the target surface e1, while a magnetic field B, the Lorentz force to the composite trochoid and spiral form on the target surface in a circular motion. With the increase in the number of collisions, the energy of electron e1 gradually reduced, little energy to pass the substrate, the substrate temperature is low. When the sputtering reaches a certain level, the surface of the target material will be consumed to form a concave widened annular area etching [1].
2.2 magnetron sputtering target in the process of coating the important role
Magnetron sputtering vacuum magnetron sputtering target is a core component of its important role mainly in the following two aspects (1) for coating large surfaces, magnetron sputtering target affects the uniformity of the film and Repeatability; (2) when the film material is a precious metal, the target structure determines the target (forming thin films), that is, the precious metal utilization.