Copper Molybdenum Copper packaging materials

Copper Molybdenum Copper (CMC) packaging material is a flat composite sandwich structure, which uses pure molybdenum as  he core material, and then covered with double-sided dispersion strengthened copper or copper.
The thermal expansion coefficient of this material is adjustable, high thermal conductivity, high temperature performance, in electronic packaging has been widely used. Copper Molybdenum tube materials are metal matrix composite planar layered electronic packaging materials, such composite materials for electronic packaging structure is stacked, generally divided into three layers, the middle layer of low expansion material layer, both sides of the high thermal conductivity of the material layer Of course, there are two, or four composite laminates. Production generally use rolling compound, composite plating, explosion forming, prepared by processing methods, such materials have very good in a planar direction and a low thermal conductivity coefficient of expansion, and there is substantially no problem dense, in addition, it kinds of materials processing cost is relatively low, for example, rolls of continuous rolling composite production Cu / Invar / Cu composite plates, can greatly reduce production costs, can be processed into 70um foil, can be widely used in PCB's core and lead frame material. Because the CMC theory of high thermal conductivity, coefficient of expansion match to Si, as early as the 1990s, domestic and foreign experts and scholars on its in-depth study of American companies and Climax Specialty Metals AMAX companies use hot composite method produced by Cu / Mo / Cu (CMC) composite materials, and applied for a patent, has been used in B2 stealth bomber electronic devices. CMC CIC are the same as the structure and three-layer composite structure, but the hardness, tensile strength, heat conductivity and high electrical conductivity than the CIC, and this is because the middle of CMC molybdenum plate, molybdenum and strength, electrical conductivity, and thermal conductivity are higher than Inar alloys.
U.S. Polymetallurgical, Polese, Elcon other companies using online technology to produce continuous rolling complex variety of sizes, partial or full wrap of electronic packaging materials, and Mo / Cu, W / Cu particles produced by powder metallurgy and other enhanced electronic packaging materials, composite method to produce flat-rolled composite electronic packaging materials, high efficiency, low cost, and can produce large-size packaging material, the flat composite material is very beneficial for electronic packaging of the electronics industry, prone "economies of scale." Ploymetallurgical cladding type material in the production of the guide within the industry, the company's products are very comprehensive and can produce Ag / Cu, Ni / Cu, Au / Ni, CIC and CMC and other local or general composite packaging materials, dimensions precise control, in which the performance of CMC in the international first-class level. There are also a Yang and Li Zhenghua, who tested the explosive compound prepared by CMC Electronics feasibility of packaging materials, packaging materials for explosive compound CMC interface bonding mechanisms were studied in detail. Study found that Cu / Mo / Cu composites have waveform explosive bonding interface and straight bond interface. Waveform molten zone exists on the interface, the melt region of the amorphous mixture of Cu and Mo organization about its composition is Cu 90%, Mo about 10%, melting microhardness of the region above the Cu matrix 1220MPa Microhardness (80MPa) less than the Mo-based microhardness (2100MPa). The results show that one way explosive compound prepared Cu / Mo / Cu composite material is feasible and appropriate process parameters can be obtained without microcracks composite material, but the method for preparing the composite explosive is more complicated and expensive, not suitable for large-scale production. Jiang Su Dingqi domestic and Technology Co., Ltd. [1] is developing a riveting high thermal conductivity of copper molybdenum copper project, has made encouraging progress.
Cu / Mo / Cu electronic packaging material has excellent thermal conductivity and thermal expansion coefficient can be adjusted, is currently the preferred domestic power electronic components of electronic packaging materials, and with Be0, Al203 ceramic match, widely used in microwave communications , RF, aerospace, power electronics, high-power semiconductor lasers, medical and other industries. For example, the now internationally popular BGA package on the extensive use of the material as the substrate. In addition, packaging and RF microwave packaging field, but also make extensive use of the heat sink material. In military electronic equipment, it is often used as a highly reliable circuit board base material.
CMC also our many key high-tech fields required supporting materials, is the high-end electronic products development and production base, for example, modern microwave communication transmitting device, power electronic devices, high-performance integrated circuits, network communication devices and other products, This excellent performance is required of the packaging materials.